Datasheet
TDA8023_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 16 July 2007 29 of 32
NXP Semiconductors
TDA8023
Low power IC card interface
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”
.
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
