Datasheet

TDA8023_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 16 July 2007 26 of 32
NXP Semiconductors
TDA8023
Low power IC card interface
13. Package outline
Fig 10. Package outline SOT361-1 (TSSOP28)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.8
0.5
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT361-1 MO-153
99-12-27
03-02-19
0.25
w M
b
p
Z
e
114
28
15
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
A
max.
1.1