Datasheet

TDA8023_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 16 July 2007 16 of 32
NXP Semiconductors
TDA8023
Low power IC card interface
In case of overcurrent on pin V
CC
, removal of the card during a session, overheating,
supply dropout, DC-to-DC out of limits, or overcurrent on pin RST, the TDA8023 performs
an automatic emergency deactivation sequence on the card, resets bit START and pulls
pin INT LOW.
9. Limiting values
[1] Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining. Method 3015 (HBM;
1500 Ω; 100 pF) defines 3 pulses positive and 3 pulses negative on each pin referenced to ground.
10. Thermal characteristics
Table 13. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DD
supply voltage on pin V
DD
−0.5 +6.5 V
V
DD(DCDC)
DC-to-DC converter
supply voltage
on pin V
DDP
−0.5 +6.5 V
V
DD(INTF)
interface supply voltage on pin V
DDI
−0.5 +6.5 V
V
IH
HIGH-level input voltage on pins SAP, SAM, SBP, SBM, VUP −0.5 +7.5 V
on pins SDA, SCL −0.5 +6.5 V
on all other pins −0.5 V
DD
+ 0.5 V
P
tot
total power dissipation T
amb
= −25 °C to +85 °C - 500 mW
T
stg
storage temperature −55 +150 °C
T
j
junction temperature - 150 °C
V
esd
electrostatic discharge
voltage
Human Body Model (HBM)
[1]
on card pins I/O, V
CC
, CLK, GNDC, PRES, RST −6+6 kV
on all other pins −2+2 kV
Machine Model (MM)
all pins, excluding card pins −200 +200 V
Table 14. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-a)
thermal resistance from junction to ambient in free air 100 K/W