Datasheet

PEMD3_PIMD3_PUMD3 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 11 — 25 September 2013 4 of 18
NXP Semiconductors
PEMD3; PIMD3; PUMD3
NPN/PNP resistor-equipped transistors
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
(1) SOT457; FR4 PCB, standard footprint
(2) SOT363 and SOT666; FR4 PCB, standard footprint
Fig 1. Per device: Power derating curves
T
amb
(°C)
-75 17512525 75-25
006aac766
200
300
100
400
500
P
tot
(mW)
0
(1)
(2)
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
PEMD3 (SOT666) - - 625 K/W
PIMD3 (SOT457) - - 500 K/W
PUMD3 (SOT363) - - 625 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
PEMD3 (SOT666) - - 417 K/W
PIMD3 (SOT457) - - 313 K/W
PUMD3 (SOT363) - - 417 K/W