Datasheet

PEMD2_PIMD2_PUMD2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 14 November 2013 4 of 18
NXP Semiconductors
PEMD2; PIMD2; PUMD2
NPN/PNP resistor-equipped transistors; R1 = 22 k, R2 = 22 k
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
(1) SOT457; FR4 PCB, standard footprint
(2) SOT363 and SOT666; FR4 PCB, standard footprint
Fig 1. Per device: Power derating curves
T
amb
(°C)
-75 17512525 75-25
006aac766
200
300
100
400
500
P
tot
(mW)
0
(1)
(2)
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
PEMD2 (SOT666)
[1]
- - 625 K/W
PIMD2 (SOT457)
[1]
- - 500 K/W
PUMD2 (SOT363)
[1]
- - 625 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
PEMD2 (SOT666)
[1]
- - 417 K/W
PIMD2 (SOT457)
[1]
- - 313 K/W
PUMD2 (SOT363)
[1]
- - 417 K/W