Datasheet

PMBT3904VS_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 8 July 2009 3 of 11
NXP Semiconductors
PMBT3904VS
40 V, 200 mA NPN/NPN switching transistor
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
T
j
junction temperature - 150 °C
T
amb
ambient temperature −55 +150 °C
T
stg
storage temperature −65 +150 °C
FR4 PCB, standard footprint
Fig 1. Per device: Power derating curve
Table 6. Limiting values
…continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
T
amb
(°C)
−75 17512525 75−25
006aab604
200
100
300
400
P
tot
(mW)
0
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 521 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
- - 100 K/W
Per device
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 347 K/W