Datasheet

PMBT3904M_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 21 July 2009 3 of 11
NXP Semiconductors
PMBT3904M
40 V, 200 mA NPN switching transistor
6. Thermal characteristics
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
(1) FR4 PCB, mounting pad for collector 1 cm
2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT883 (SC-101)
T
amb
(°C)
−75 17512525 75−25
006aab602
400
200
600
800
P
tot
(mW)
0
(2)
(1)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
- - 481 K/W
[1][3]
- - 212 K/W