Datasheet

PIMN31_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 19 June 2007 8 of 11
NXP Semiconductors
PIMN31
500 mA, 50 V NPN/NPN double RET; R1 = 1 kΩ, R2 = 10 kΩ
11. Soldering
Dimensions in mm
Fig 9. Reflow soldering footprint SOT457 (SC-74)
Dimensions in mm
Fig 10. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
0.95
2.825
0.45 0.55
1.60
1.95
3.45
1.70
3.10
3.20
3.30
msc422
1.40
4.30
5.30
0.45
msc423
1.45 4.45
5.05
solder lands
solder resist
occupied area