Datasheet

NXP Semiconductors
PHPT61003PY
100 V, 3A PNP high power bipolar transistor
PHPT61003PY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 13 January 2014 11 / 15
13. Soldering
0.6
(3×)
0.7
(4×)
0.25
(2×)
0.25
(2×)
0.6
(4×)
4.2
4.7
0.25
(2×)
1.27
1.1
2
3.81
0.9
(3×)
SP opening =
Cu - 0.050
SR opening =
Cu + 0.075
2.15
2.55
3.45
3.5
3.3
solder lands
solder resist
occupied area
solder paste
125 µm stencil
Dimensions in mm
SOT669
Footprint information for reflow soldering
sot669_fr
Fig. 15. Reflow soldering footprint for LFPAK56; Power-SO8 (SOT669)