Datasheet

PCF8574_PCF8574A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 5 — 27 May 2013 2 of 33
NXP Semiconductors
PCF8574; PCF8574A
Remote 8-bit I/O expander for I
2
C-bus with interrupt
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: DIP16, SO16, SSOP20
3. Applications
LED signs and displays
Servers
Key pads
Industrial control
Medical equipment
PLC
Cellular telephones
Mobile devices
Gaming machines
Instrumentation and test measurement
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Topside mark Package
Name Description Version
PCF8574P PCF8574P DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
PCF8574AP PCF8574AP
PCF8574T/3 PCF8574T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
PCF8574AT/3 PCF8574AT
PCF8574TS/3 8574TS SSOP20 plastic shrink small outline package; 20 leads;
body width 4.4 mm
SOT266-1
PCF8574ATS/3 8574A
Table 2. Ordering options
Type number Orderable
part number
Package Packing method Minimum
order
quantity
Temperature range
PCF8574P PCF8574P,112 DIP16 Standard marking
* IC’s tube - DSC bulk pack
1000 T
amb
= 40 C to +85 C
PCF8574AP PCF8574AP,112 DIP16 Standard marking
* IC’s tube - DSC bulk pack
1000 T
amb
= 40 C to +85 C
PCF8574T/3 PCF8574T/3,512 SO16 Standard marking
* tube dry pack
1920 T
amb
= 40 C to +85 C
PCF8574T/3,518 SO16 Reel 13” Q1/T1
*standard mark SMD dry pack
1000 T
amb
= 40 C to +85 C
PCF8574AT/3 PCF8574AT/3,512 SO16 Standard marking
* tube dry pack
1920 T
amb
= 40 C to +85 C
PCF8574AT/3,518 SO16 Reel 13” Q1/T1
*standard mark SMD dry pack
1000 T
amb
= 40 C to +85 C