Datasheet

NXP Semiconductors
PCAL6416A
Low-voltage translating 16-bit I
2
C-bus/SMBus I/O expander
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 9 October 2014
Document identifier: PCAL6416A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 2
2.1 Agile I/O features . . . . . . . . . . . . . . . . . . . . . . . 3
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
3.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 Voltage translation. . . . . . . . . . . . . . . . . . . . . . . 8
7 Functional description . . . . . . . . . . . . . . . . . . . 9
7.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 9
7.2 Interface definition . . . . . . . . . . . . . . . . . . . . . . 9
7.3 Pointer register and command byte . . . . . . . . . 9
7.4 Register descriptions . . . . . . . . . . . . . . . . . . . 11
7.4.1 Input port register pair (00h, 01h). . . . . . . . . . 11
7.4.2 Output port register pair (02h, 03h) . . . . . . . . 11
7.4.3 Polarity inversion register pair (04h, 05h) . . . . 12
7.4.4 Configuration register pair (06h, 07h). . . . . . . 12
7.4.5 Output drive strength register pairs
(40h, 41h, 42h, 43h) . . . . . . . . . . . . . . . . . . . . 13
7.4.6 Input latch register pair (44h, 45h) . . . . . . . . . 13
7.4.7 Pull-up/pull-down enable register pair
(46h, 47h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
7.4.8 Pull-up/pull-down selection register pair
(48h, 49h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.4.9 Interrupt mask register pair (4Ah, 4Bh). . . . . . 15
7.4.10 Interrupt status register pair (4Ch, 4Dh) . . . . . 16
7.4.11 Output port configuration register (4Fh) . . . . . 16
7.5 I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.6 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 17
7.7 Reset input (RESET
) . . . . . . . . . . . . . . . . . . . 17
7.8 Interrupt output (INT) . . . . . . . . . . . . . . . . . . . 18
8 Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 18
8.1 Write commands. . . . . . . . . . . . . . . . . . . . . . . 18
8.2 Read commands . . . . . . . . . . . . . . . . . . . . . . 20
9 Application design-in information . . . . . . . . . 24
9.1 Minimizing I
DD
when the I/Os are used to
control LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . 24
9.2 Output drive strength control . . . . . . . . . . . . . 25
9.3 Power-on reset requirements . . . . . . . . . . . . . 26
9.4 Device current consumption with internal
pull-up and pull-down resistors. . . . . . . . . . . . 28
9.5 I
2
C-bus error recovery techniques . . . . . . . . . 28
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 29
11 Recommended operating conditions. . . . . . . 30
12 Thermal characteristics . . . . . . . . . . . . . . . . . 30
13 Static characteristics . . . . . . . . . . . . . . . . . . . 31
13.1 Typical characteristics . . . . . . . . . . . . . . . . . . 33
14 Dynamic characteristics. . . . . . . . . . . . . . . . . 37
15 Parameter measurement information . . . . . . 38
16 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 42
17 Soldering of SMD packages. . . . . . . . . . . . . . 47
17.1 Introduction to soldering. . . . . . . . . . . . . . . . . 47
17.2 Wave and reflow soldering. . . . . . . . . . . . . . . 47
17.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 47
17.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 48
18 Soldering: PCB footprints . . . . . . . . . . . . . . . 50
19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 58
20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 58
21 Legal information . . . . . . . . . . . . . . . . . . . . . . 59
21.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 59
21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
21.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 59
21.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 60
22 Contact information . . . . . . . . . . . . . . . . . . . . 60
23 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61