Datasheet
PCAL6408A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 18 September 2013 3 of 49
NXP Semiconductors
PCAL6408A
Low-voltage translating, 8-bit I
2
C-bus/SMBus I/O expander
ESD protection exceeds JESD 22
2000 V Human-Body Model (A114-A)
1000 V Charged-Device Model (C101)
Packages offered: HVQFN16, TSSOP16, XQFN16,
XFBGA16 (1.6 mm 1.6 mm 0.5 mm)
2.1 Agile I/O features
Software backward compatible with PCA6408A with interrupts disabled at power-up
Pin-to-pin drop-in replacement for PCA6408A
Output port configuration: bank selectable push-pull or open-drain output stages
Interrupt status: read-only register identifies the source of an interrupt
Bit-wise I/O programming features:
Output drive strength: four programmable drive strengths to reduce rise and fall
times in low-capacitance applications
Input latch: Input Port register values changes are kept until the Input Port register
is read
Pull-up/pull-down enable: floating input or pull-up/pull-down resistor enable
Pull-up/pull-down selection: 100 k pull-up/pull-down resistor selection
Interrupt mask: mask prevents the generation of the interrupt when input changes
state to prevent spurious interrupts
3. Ordering information
Table 1. Ordering information
Type number Topside
marking
Package
Name Description Version
PCAL6408ABS L8A HVQFN16 plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 3 0.85 mm
SOT758-1
PCAL6408APW PL6408A TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
PCAL6408AHK L8 XQFN16 plastic, extremely thin quad flat package; no leads; 16 terminals;
body 1.80 2.60 0.50 mm
SOT1161-1
PCAL6408AEX L8 XFBGA16 plastic, extremely thin fine-pitch ball grid array package; 16 balls;
body 1.6 1.6 0.5 mm
SOT1354-1