Datasheet

PCA9703 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
Product data sheet Rev. 4 — 5 September 2014 4 of 28
NXP Semiconductors
PCA9703
18 V tolerant SPI 16-bit GPI with maskable INT
6.2 Pin description
[1] HWQFN24 package die supply ground is connected to both V
SS
pin and exposed center pad. V
SS
pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
Table 2. Pin description
Symbol Pin Type Description
TSSOP24 HWQFN24
SDOUT 1 22 output 3-state serial data output; normally
high-impedance
INT
2 23 output open-drain interrupt output (active LOW)
INT_EN 3 24 input GPI pin enable and interrupt output enable
1 = GPI pin and interrupt output are enabled
0 = GPI pin and interrupt output are disabled and
interrupt output is high-impedance
IN0 4 1 input input port 0
IN1 5 2 input input port 1
IN2 6 3 input input port 2
IN3 7 4 input input port 3
IN4 8 5 input input port 4
IN5 9 6 input input port 5
IN6 10 7 input input port 6
IN7 11 8 input input port 7
V
SS
12 9
[1]
ground ground supply
IN8 13 10 input input port 8
IN9 14 11 input input port 9
IN10 15 12 input input port 10
IN11 16 13 input input port 11
IN12 17 14 input input port 12
IN13 18 15 input input port 13
IN14 19 16 input input port 14
IN15 20 17 input input port 15
CS
21 18 input chip select (active LOW)
SCLK 22 19 input serial input clock
SDIN 23 20 input serial data input (20 A pull-down)
V
DD
24 21 supply supply voltage