Datasheet

PCA9701_PCA9702 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 7 — 26 September 2014 5 of 29
NXP Semiconductors
PCA9701; PCA9702
18 V tolerant SPI 16-bit/8-bit GPI with INT
6.2 Pin description
[1] HWQFN24 package die supply ground is connected to both V
SS
pin and exposed center pad. V
SS
pin must be connected to supply
ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be
soldered to the board using a corresponding thermal pad on the board and for proper heat conduction through the board, thermal vias
need to be incorporated in the PCB in the thermal pad region.
Table 3. Pin description
Symbol Pin Type Description
SO24, TSSOP24 HWQFN24 TSSOP16
SDOUT 1 22 1 output 3-state serial data output; normally high-impedance
INT
2 23 2 output open-drain interrupt output (active LOW)
INT_EN 3 24 3 input interrupt output enable
1 = interrupt is enabled
0 = interrupt is disabled and high-impedance
IN0 4 1 4 input input port 0
IN1 5 2 5 input input port 1
IN2 6 3 6 input input port 2
IN3 7 4 7 input input port 3
IN4 8 5 9 input input port 4
IN5 9 6 10 input input port 5
IN6 10 7 11 input input port 6
IN7 11 8 12 input input port 7
V
SS
12 9
[1]
8 ground ground supply
IN8 13 10 - input input port 8
IN9 14 11 - input input port 9
IN10 15 12 - input input port 10
IN11 16 13 - input input port 11
IN12 17 14 - input input port 12
IN13 18 15 - input input port 13
IN14 19 16 - input input port 14
IN15 20 17 - input input port 15
CS
21 18 13 input chip select (active LOW)
SCLK 22 19 14 input serial input clock
SDIN 23 20 15 input serial data input (20 A pull-down)
V
DD
24 21 16 supply supply voltage