Datasheet

PCA9701_PCA9702 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 7 — 26 September 2014 25 of 29
NXP Semiconductors
PCA9701; PCA9702
18 V tolerant SPI 16-bit/8-bit GPI with INT
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 10. Abbreviations
Acronym Description
ASSP Application Specific Standard Product
CAN Controller Area Network
CDM Charged-Device Model
DUT Device Under Test
ECU Electronic Control Unit
ESD ElectroStatic Discharge
GPI General Purpose Input
HBM Human Body Model
HS-CAN High-Speed Controller Area Network
LIN Local Interconnect Network
LSB Least Significant Bit
MM Machine Model
MSB Most Significant Bit
PCB Printed-Circuit Board
PPAP Production Part Approval Process
RC Resistor-Capacitor network
SBC System Basis Chip
SPI Serial Peripheral Interface
C microcontroller