Datasheet

NXP Semiconductors
PCA9674; PCA9674A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 30 May 2013
Document identifier: PCA9674_PCA9674A
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
23. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7 Functional description . . . . . . . . . . . . . . . . . . . 6
7.1 Device address. . . . . . . . . . . . . . . . . . . . . . . . . 6
7.1.1 Address maps. . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.2 Software Reset Call, and device ID addresses 11
7.2.1 Software Reset. . . . . . . . . . . . . . . . . . . . . . . . 11
7.2.2 Device ID (PCA9674; PCA9674A ID field) . . . 12
8 I/O programming . . . . . . . . . . . . . . . . . . . . . . . 14
8.1 Quasi-bidirectional I/Os . . . . . . . . . . . . . . . . . 14
8.2 Writing to the port (Output mode) . . . . . . . . . . 15
8.3 Reading from a port (Input mode) . . . . . . . . . 16
8.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 17
8.5 Interrupt output (INT
) . . . . . . . . . . . . . . . . . . . 17
9 Characteristics of the I
2
C-bus . . . . . . . . . . . . 18
9.1 Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9.1.1 START and STOP conditions . . . . . . . . . . . . . 18
9.2 System configuration . . . . . . . . . . . . . . . . . . . 18
9.3 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 19
10 Application design-in information . . . . . . . . . 20
10.1 Bidirectional I/O expander applications . . . . . 20
10.2 How to read and write to I/O expander
(example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10.3 High current-drive load applications . . . . . . . . 21
10.4 Migration path. . . . . . . . . . . . . . . . . . . . . . . . . 21
11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 22
12 Thermal characteristics . . . . . . . . . . . . . . . . . 22
13 Static characteristics. . . . . . . . . . . . . . . . . . . . 23
14 Dynamic characteristics . . . . . . . . . . . . . . . . . 24
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
16 Handling information. . . . . . . . . . . . . . . . . . . . 29
17 Soldering of SMD packages . . . . . . . . . . . . . . 29
17.1 Introduction to soldering . . . . . . . . . . . . . . . . . 29
17.2 Wave and reflow soldering . . . . . . . . . . . . . . . 29
17.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 29
17.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 30
18 Soldering: PCB footprints. . . . . . . . . . . . . . . . 32
19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 35
20 Revision history . . . . . . . . . . . . . . . . . . . . . . . 35
21 Legal information . . . . . . . . . . . . . . . . . . . . . . 38
21.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38
21.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
21.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 38
21.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39
22 Contact information . . . . . . . . . . . . . . . . . . . . 39
23 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40