Datasheet

PCA9674_PCA9674A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 7 — 30 May 2013 33 of 40
NXP Semiconductors
PCA9674; PCA9674A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
Fig 28. PCB footprint for SOT162-1 (SO16); reflow soldering
DIMENSIONS in mm
Ay By D1 D2 Gy HyP1
11.200 6.400 2.400 0.700
C
0.800 10.040 8.600
Gx
11.450
sot162-1_fr
Hx
11.9001.270
SOT162-1
solder land
occupied area
Footprint information for reflow soldering of SO16 package
AyByGy
C
Hy
Hx
Gx
P1
Generic footprint pattern
Refer to the package outline drawing for actual layout
P2
(0.125) (0.125)
D1
D2 (4x)
P2
1.320