Datasheet
PCA9670 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 30 May 2013 2 of 35
NXP Semiconductors
PCA9670
Remote 8-bit I/O expander for Fm+ I
2
C-bus with reset
ESD protection exceeds 2000 V HBM per JESD22-A114 and 1000 V CDM per
JESD22-C101
Latch-up testing is done to JEDEC standard JESD78 which exceeds 100 mA
Packages offered: SO16, TSSOP16 and HVQFN16
3. Applications
LED signs and displays
Servers
Keypads
Industrial control
Medical equipment
PLCs
Cellular telephones
Mobile devices
Gaming machines
Instrumentation and test measurement
4. Ordering information
4.1 Ordering options
Table 1. Ordering information
Type number Topside
marking
Package
Name Description Version
PCA9670BS 670 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 3 0.85 mm
SOT758-1
PCA9670D PCA9670D SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
PCA9670PW PCA9670 TSSOP16 plastic thin shrink small outline package; 16 leads;
body width 4.4 mm
SOT403-1
Table 2. Ordering options
Type number Orderable
part number
Package Packing method Minimum
order
quantity
Temperature range
PCA9670BS PCA9670BS,118 HVQFN16 Reel 13” Q1/T1
*standard mark SMD
6000 T
amb
= 40 C to +85 C
PCA9670D PCA9670D,512 SO16 Standard marking * tube dry pack 1920 T
amb
= 40 C to +85 C
PCA9670D,518 SO16 Reel 13” Q1/T1
*standard mark SMD dry pack
1000 T
amb
= 40 C to +85 C
PCA9670PW PCA9670PW,112 TSSOP16 Standard marking *
IC’s tube - DSC bulk pack
2400 T
amb
= 40 C to +85 C
PCA9670PW,118 TSSOP16 Reel 13” Q1/T1
*standard mark SMD
2500 T
amb
= 40 C to +85 C
