Datasheet

PCA9614 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 1 — 11 April 2014 19 of 27
NXP Semiconductors
PCA9614
2-channel multipoint Fm+ differential I
2
C-bus buffer
13. Package outline
Fig 16. Package outline SOT552-1 (TSSOP10)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.15
0.23
0.15
3.1
2.9
3.1
2.9
0.5
5.0
4.8
0.67
0.34
6°
0°
0.1 0.10.10.95
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT552-1
99-07-29
03-02-18
w M
b
p
D
Z
e
0.25
15
10
6
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
1.1
pin 1 index