Datasheet

PCA9600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 5 May 2011 27 of 31
NXP Semiconductors
PCA9600
Dual bidirectional bus buffer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
13. Abbreviations
MSL: Moisture Sensitivity Level
Fig 28. Temperature profiles for large and small components
001aac84
4
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 10. Abbreviations
Acronym Description
CDM Charged-Device Model
ESD ElectroStatic Discharge
HBM Human Body Model
I
2
C-bus Inter-Integrated Circuit bus
I/O Input/Output
IC Integrated Circuit
PMBus Power Management Bus
SMBus System Management Bus
TTL Transistor-Transistor Logic