Datasheet

PCA9555_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 22 October 2009 31 of 34
NXP Semiconductors
PCA9555
16-bit I
2
C-bus and SMBus I/O port with interrupt
16.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Abbreviations
Table 18. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 19. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
GPIO General Purpose Input/Output
I
2
C-bus Inter-Integrated Circuit bus
SMBus System Management Bus
I/O Input/Output
ACPI Advanced Configuration and Power Interface
LED Light Emitting Diode
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
CDM Charged Device Model
PCB Printed-Circuit Board
FET Field-Effect Transistor
MSB Most Significant Bit
LSB Least Significant Bit