Datasheet

PCA9555_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 22 October 2009 2 of 34
NXP Semiconductors
PCA9555
16-bit I
2
C-bus and SMBus I/O port with interrupt
n Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
n Six packages offered: DIP24, SO24, SSOP24, TSSOP24, HVQFN24 and HWQFN24
3. Ordering information
3.1 Ordering options
Table 1. Ordering information
Type number Package
Name Description Version
PCA9555N DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1
PCA9555D SO24 plastic small outline package; 24 leads;
body width 7.5 mm
SOT137-1
PCA9555DB SSOP24 plastic shrink small outline package; 24 leads;
body width 5.3 mm
SOT340-1
PCA9555PW TSSOP24 plastic thin shrink small outline package; 24 leads;
body width 4.4 mm
SOT355-1
PCA9555BS HVQFN24 plastic thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 4 × 4 × 0.85 mm
SOT616-1
PCA9555HF HWQFN24 plastic thermal enhanced very very thin quad flat
package; no leads; 24 terminals; body 4 × 4 × 0.75 mm
SOT994-1
Table 2. Ordering options
Type number Topside mark Temperature range
PCA9555N PCA9555 −40 °C to +85 °C
PCA9555D PCA9555D −40 °C to +85 °C
PCA9555DB PCA9555 −40 °C to +85 °C
PCA9555PW PCA9555 −40 °C to +85 °C
PCA9555BS 9555 −40 °C to +85 °C
PCA9555HF P55H −40 °C to +85 °C