Datasheet
PCA9535_PCA9535C_5 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 05 — 15 September 2008 5 of 31
NXP Semiconductors
PCA9535; PCA9535C
16-bit I
2
C-bus and SMBus, low power I/O port with interrupt
5.2 Pin description
[1] HVQFN24 and HWQFN24 package die supply ground is connected to both the V
SS
pin and the exposed
center pad. The V
SS
pin must be connected to supply ground for proper device operation. For enhanced
thermal, electrical, and board-level performance, the exposed pad needs to be soldered to the board using
a corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias
need to be incorporated in the PCB in the thermal pad region.
[2] PCA9535 I/Os are totem pole, whereas the I/Os on PCA9535C are open-drain.
Table 3. Pin description
Symbol Pin Description
SO24, TSSOP24 HVQFN24,
HWQFN24
INT 1 22 interrupt output (open-drain)
A1 2 23 address input 1
A2 3 24 address input 2
IO0_0 4 1 port 0 input/output
[2]
IO0_1 5 2
IO0_2 6 3
IO0_3 7 4
IO0_4 8 5
IO0_5 9 6
IO0_6 10 7
IO0_7 11 8
V
SS
12 9
[1]
supply ground
IO1_0 13 10 port 1 input/output
[2]
IO1_1 14 11
IO1_2 15 12
IO1_3 16 13
IO1_4 17 14
IO1_5 18 15
IO1_6 19 16
IO1_7 20 17
A0 21 18 address input 0
SCL 22 19 serial clock line
SDA 23 20 serial data line
V
DD
24 21 supply voltage
