Datasheet

PCA9513A_PCA9514A_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 18 August 2009 23 of 26
NXP Semiconductors
PCA9513A; PCA9514A
Hot swappable I
2
C-bus and SMBus bus buffer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 24. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 8. Abbreviations
Acronym Description
AdvancedTCA Advanced Telecommunications Computing Architecture
CDM Charged-Device Model
cPCI compact Peripheral Component Interface
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
I
2
C-bus Inter-Integrated Circuit bus
MM Machine Model
PCI Peripheral Component Interface
PICMG PCI Industrial Computer Manufacturers Group
SMBus System Management Bus
VME VERSAModule Eurocard