Datasheet

PCA9513A_PCA9514A_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 18 August 2009 20 of 26
NXP Semiconductors
PCA9513A; PCA9514A
Hot swappable I
2
C-bus and SMBus bus buffer
Fig 23. Package outline SOT505-1 (TSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
0.65
5.1
4.7
0.70
0.35
6°
0°
0.1 0.10.10.94
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.7
0.4
SOT505-1
99-04-09
03-02-18
w M
b
p
D
Z
e
0.25
14
8
5
θ
A
A
2
A
1
L
p
(A
3
)
detail X
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
1.1
pin 1 index