Datasheet

PCA9512A_PCA9512B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 6 — 1 March 2013 22 of 27
NXP Semiconductors
PCA9512A; PCA9512B
Level shifting hot swappable I
2
C-bus and SMBus bus buffer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Soldering: PCB footprints
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Fig 19. PCB footprint for SOT96-1 (SO8); reflow soldering
sot096-1_fr
occupied area
solder lands
Dimensions in mm
placement accuracy ± 0.25
1.30
0.60 (8×)
1.27 (6×)
4.00 6.60
5.50
7.00