Datasheet

PCA9510A_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 18 August 2009 21 of 24
NXP Semiconductors
PCA9510A
Hot swappable I
2
C-bus and SMBus bus buffer
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
15. Abbreviations
MSL: Moisture Sensitivity Level
Fig 21. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 8. Abbreviations
Acronym Description
AdvancedTCA Advanced Telecommunications Computing Architecture
CDM Charged Device Model
cPCI compact Peripheral Component Interface
DUT Device Under Test
ESD Electrostatic Discharge
HBM Human Body Model
I
2
C-bus Inter IC bus
MM Machine Model
PCI Peripheral Component Interface
PICMG PCI Industrial Computer Manufacturers Group
RC Resistor-Capacitor network
SMBus System Management Bus
VME VERSAModule Eurocard