Datasheet

PCA6408A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 27 September 2012 36 of 40
NXP Semiconductors
PCA6408A
Low-voltage, 8-bit I
2
C-bus and SMBus I/O expander
Fig 36. PCB footprint for SOT1161-1 (XQFN16); reflow soldering
SOT1161-1Footprint information for reflow soldering of XQFN16 package
sot1161-1_fr
occupied area
solder land
placement area
solder resist, 0.0625 around copper
solder land plus solder paste
Dimensions in mm
clearance, 0.125 around occupied area
1.8
CU
0.22
CU
(16×)
1.65
0.4 (12×)
1.65
2.1 CU
2.35
0.45
3.15
2.9
CU
0.9
CU
1
CU
solder paste deposit, −0.02 around copper,
stencil thickness 0.1