Datasheet

NXP Semiconductors
PBSS5130T
30 V; 1 A PNP low VCEsat (BISS) transistor
PBSS5130T All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 9 July 2013 7 / 11
13. Soldering
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
Fig. 8. Reflow soldering footprint for TO-236AB (SOT23)
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
Fig. 9. Wave soldering footprint for TO-236AB (SOT23)