Datasheet

PBSS4630PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 6 May 2010 11 of 15
NXP Semiconductors
PBSS4630PA
30 V, 6 A NPN low V
CEsat
(BISS) transistor
11. Soldering
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering footprint SOT1061 (HUSON3)
occupied area
solder paste = solder lands
Dimensions in mm
sot1061_fr
solder resist
0.4
2.1
1.3
0.25
0.25
0.25
1.1 1.2
0.55
0.6
2.3
0.5 (2×)
0.5 (2×) 0.6 (2×)
0.4 (2×)
0.5
1.6
1.7
1.05