Datasheet

PBSS4032PX_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 01 — 1 April 2010 11 of 15
NXP Semiconductors
PBSS4032PX
30 V, 4.2 A PNP low V
CEsat
(BISS) transistor
11. Soldering
Fig 16. Reflow soldering footprint SOT89 (SC-62)
Fig 17. Wave soldering footprint SOT89 (SC-62)
solder lands
solder resist
occupied area
solder paste
sot089_
fr
1.2
1.9
2
2.25
4.75
1
(3×)
0.7
(3×)
0.6
(3×)
1.1
(2×)
1.2
0.85
0.2
0.5
1.7
4.85
3.95
4.6
1.51.5
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot089_
fw
0.7
5.3
6.6
2.4
3.5
0.5
1.8
(2×)
1.5
(2×)
7.6
1.9 1.9
Dimensions in mm