Datasheet

PBSS4032NT_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 18 December 2009 11 of 14
NXP Semiconductors
PBSS4032NT
30 V, 2.6 A NPN low V
CEsat
(BISS) transistor
11. Soldering
Fig 16. Reflow soldering footprint SOT23 (TO-236AB)
Fig 17. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_
fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_
fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm