Datasheet

PBSS304NX_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 20 November 2009 11 of 15
NXP Semiconductors
PBSS304NX
60 V, 4.7 A NPN low V
CEsat
(BISS) transistor
11. Soldering
SOT89 standard mounting conditions for reflow soldering
Fig 16. Reflow soldering footprint
Not recommended for wave soldering
Fig 17. Wave soldering footprint
msa442
1.00
(3x)
4.85
4.60
1.20
4.75
0.60 (3x)
0.70 (3x)
3.70
3.95
1.20
0.50
1.70
132
0.20
0.85
1.20
1.20
1.90
2.00
2.25
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa423
preferred transport direction during soldering
3.00
7.60
6.60
1.20
5.30
1.50
0.50
3.50
2.40
13
2
0.70
solder lands
solder resist
occupied area
Dimensions in mm