Datasheet

PBSS302PX_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 20 November 2009 11 of 15
NXP Semiconductors
PBSS302PX
20 V, 5.1 A PNP low V
CEsat
(BISS) transistor
11. Soldering
Fig 16. Reflow soldering footprint SOT89 (SC-62)
Not recommended for wave soldering
Fig 17. Wave soldering footprint SOT89 (SC-62)
msa442
1.00
(3x)
4.85
4.60
1.20
4.75
0.60 (3x)
0.70 (3x)
3.70
3.95
1.20
0.50
1.70
132
0.20
0.85
1.20
1.20
1.90
2.00
2.25
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa423
preferred transport direction during soldering
3.00
7.60
6.60
1.20
5.30
1.50
0.50
3.50
2.40
13
2
0.70
solder lands
solder resist
occupied area
Dimensions in mm