Datasheet

PBSM5240PF All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 20 April 2011 16 of 20
NXP Semiconductors
PBSM5240PF
40 V, 2 A PNP BISS/Trench MOSFET module
10. Soldering
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT1118
sot1118_
fr
Dimensions in mm
solder paste
solder resist
occupied area
solder lands
0.49 0.49
0.650.65
0.875
0.875
2.25
0.35
(6×)
0.3
(6×)
0.4
(6×)
0.45
(6×)
0.72
(2×)
0.82
(2×)
1.05
(2×)
1.15
(2×)
2.1