Datasheet

PBRP123ET_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 16 January 2008 9 of 12
NXP Semiconductors
PBRP123ET
PNP 800 mA, 40 V BISS RET; R1 = 2.2 kΩ, R2 = 2.2 kΩ
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
PBRP123ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235
Fig 12. Reflow soldering footprint SOT23 (TO-236AB)
Fig 13. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands