Datasheet

PBRN123Y_SER_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 27 February 2007 7 of 17
NXP Semiconductors
PBRN123Y series
NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kΩ, R2 = 10 kΩ
Ceramic PCB, Al
2
O
3
, standard footprint
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for
SOT23 (TO-236AB) and SOT346 (SC-59A/TO-236); typical values
FR4 PCB, standard footprint
Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration for
SOT54 (SC-43A/TO-92); typical values
006aab002
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
−1
10
−5
1010
−2
10
−4
10
2
10
−1
t
p
(s)
10
−3
10
3
1
0.75
0.50
0.33
0.20
0.01
0.10
0.05
0.02
0
δ = 1
006aab003
10
−5
1010
−2
10
−4
10
2
10
−1
t
p
(s)
10
−3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
0.75
0.50
0.33
0.20
0.01
0.10
0.05
0.02
0
δ = 1