Datasheet

PBRN123E_SER_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 27 February 2007 14 of 17
NXP Semiconductors
PBRN123E series
NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kΩ, R2 = 2.2 kΩ
Fig 21. Wave soldering footprint SOT23 (TO-236AB)
sot023
4.004.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands