Datasheet

PBRN123E_SER_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 27 February 2007 13 of 17
NXP Semiconductors
PBRN123E series
NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kΩ, R2 = 2.2 kΩ
Fig 19. Wave soldering footprint SOT346 (SC-59A/TO-236)
Fig 20. Reflow soldering footprint SOT23 (TO-236AB)
sot346
4.605.20
2.80
4.70
12
3
1.20
3.40
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85