Datasheet

PBRN123E_SER_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 27 February 2007 12 of 17
NXP Semiconductors
PBRN123E series
NPN 800 mA, 40 V BISS RETs; R1 = 2.2 kΩ, R2 = 2.2 kΩ
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 5000 10000
PBRN123EK SOT346 4 mm pitch, 8 mm tape and reel -115 - -135
PBRN123ES SOT54 bulk, straight leads - -412 -
SOT54A tape and reel, wide pitch - - -116
tape ammopack, wide pitch - - -126
SOT54 variant bulk, delta pinning - -112 -
PBRN123ET SOT23 4 mm pitch, 8 mm tape and reel -215 - -235
Fig 18. Reflow soldering footprint SOT346 (SC-59A/TO-236)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
sot346
1.00
0.70
(3x)
1.55
2.60
3.40
0.95
3.15
3
12
1.20
0.60 (3x)
0.70 (3x)
3.30
0.95
2.90