Datasheet

PBLS6003D_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 7 September 2009 13 of 16
NXP Semiconductors
PBLS6003D
60 V PNP BISS loadswitch
11. Soldering
Dimensions in mm
Fig 20. Reflow soldering footprint
Dimensions in mm
Fig 21. Wave soldering footprint
solder lands
solder resist
occupied area
solder paste
0.95
2.825
0.45 0.55
1.60
1.95
3.45
1.70
3.10
3.20
3.30
msc422
1.40
4.30
5.30
0.45
msc423
1.45 4.45
5.05
solder lands
solder resist
occupied area