Datasheet

NXP Semiconductors
P82B96
Dual bidirectional bus buffer
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 10 November 2009
Document identifier: P82B96_8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 4
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Application information. . . . . . . . . . . . . . . . . . 10
10.1 Calculating system delays and bus clock
frequency for a Fast mode system . . . . . . . . . 15
10.2 Negative undershoot below absolute minimum
value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
10.2.1 Example with questions and answers. . . . . . . 20
11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23
12 Soldering of SMD packages . . . . . . . . . . . . . . 26
12.1 Introduction to soldering . . . . . . . . . . . . . . . . . 26
12.2 Wave and reflow soldering . . . . . . . . . . . . . . . 26
12.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 26
12.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 27
13 Soldering of through-hole mount packages . 28
13.1 Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
13.2 Soldering by dipping or by solder wave . . . . . 28
13.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 28
13.4 Package related soldering information . . . . . . 29
14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 29
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 30
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 31
17 Contact information. . . . . . . . . . . . . . . . . . . . . 31
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32