Datasheet

P82B96_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 10 November 2009 29 of 32
NXP Semiconductors
P82B96
Dual bidirectional bus buffer
13.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
14. Abbreviations
Table 9. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 10. Abbreviations
Acronym Description
CDM Charged Device Model
DDC Display Data Channel
ESD ElectroStatic Discharge
HBM Human Body Model
IC Integrated Circuit
I
2
C-bus Inter IC bus
MM Machine Model
SMBus System Management Bus