Datasheet

P82B715_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 9 November 2009 20 of 23
NXP Semiconductors
P82B715
I
2
C-bus extender
14.4 Package related soldering information
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
15. Abbreviations
Table 8. Suitability of through-hole mount IC packages for dipping and wave soldering
Package Soldering method
Dipping Wave
CPGA, HCPGA - suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable
[1]
PMFP
[2]
- not suitable
Table 9. Abbreviations
Acronym Description
AdvancedTCA Advanced Telecom Computing Architecture
CMOS Complementary Metal-Oxide Semiconductor
DDC Data Display Channel
EMI ElectroMagnetic Interference
ESD ElectroStatic Discharge
FRU Field Replaceable Unit
HBM Human Body Model
I
2
C-bus Inter-Integrated Circuit bus
I/O Input/Output
IC Integrated Circuit
IPMB Intelligent Platform Management Bus
MM Machine Model
PMBus Power Management Bus
RC Resistor-Capacitor network
ShMM Shelf Management Module
SMBus System Management Bus
TTL Transistor-Transistor Logic