Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsSensorsPressure sensor -50 kPa up to 0 kPa SMD

MPXV5050VC6T1

Rev 2, 11/2009

Freescale Semiconductor

Pressure

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated and

Calibrated

The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and

thin film resistor networks to provide a high output signal and temperature

compensation. The small form factor and high reliability of on-chip integration

make the Freescale Semiconductor, Inc. pressure sensor a logical and

economical choice for the system designer.

The MPXV5050V series piezoresistive transducer is a state-of-the-art,

monolithic, signal conditioned, silicon pressure sensor. This sensor combines

advanced micromachining techniques, thin film metallization, and bipolar

semiconductor processing to provide an accurate, high level analog output signal

that is proportional to applied pressure.

Features

• 2.5% Maximum Error over 0° to 85°C

• Ideally suited for Microprocessor or Microcontroller-Based Systems

• Temperature Compensated from Over -40° to +125°C

• Patented Silicon Shear Stress Strain Gauge

• Durable Thermoplastic (PPS) Surface Mount Package

• Easy-to-Use Chip Carrier Option

• Ideal for Automotive and Non-Automotive Applications

ORDERING INFORMATION

Device Name

Case

No.

# of Ports Pressure Type

Device

Marking

None Single Dual Gauge Differential Absolute

Small Outline Package

MPXV5050VC6T1 482A • • Vacuum/Gauge MPXV5050V

MPXV5050V

-50 to 0 kPa (-7.25 to 0 psi)

0.1 to 4.6 V Output

Series

SMALL OUTLINE PACKAGE

MPXV5050VC6T1

CASE 482A-01

Application Examples

• Vacuum Pump Monitoring

Summary of content (8 pages)

PAGE 1
Pressure Freescale Semiconductor MPXV5050VC6T1 Rev 2, 11/2009 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated MPXV5050V Series -50 to 0 kPa (-7.25 to 0 psi) 0.1 to 4.6 V Output The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation.
PAGE 2
Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range POP -50 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Full Scale Output(2) @ VS = 5.0 Volts (0 to 85°C) VFSO 4.488 4.6 4.713 Vdc Full Scale Span(3) @ VS = 5.0 Volts (0 to 85°C) VFSS — 4.5 — Vdc Accuracy(4) (0 to 85°C) — — — ±2.
PAGE 3
Pressure Maximum Ratings Table 2. Maximum Ratings(1) Rating Symbol Value Units Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg -40 to +125 °C Operating Temperature TA -40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
PAGE 4
Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 482A). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0° to 85°C temperature range. The output will saturate outside of the rated pressure range.
PAGE 5
Pressure Transfer Function (MPXV5050V) Nominal Transfer Value: VOUT = VS x (0.018 x P + 0.92) ± (Pressure Error x Temp Multi x 0.018 x VS) VS = 5.0 ± 0.25 V Temperature Error Band MPXV5050V 4.0 Break Points Temp 3.0 Temperature Error Factor Multiplier –40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.
PAGE 6
Pressure SURFACE MOUNTING INFORMATION MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process.
PAGE 7
Pressure PACKAGE DIMENSIONS -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.
PAGE 8
How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.