Datasheet

MPX5010
Sensors
Freescale Semiconductor, Inc. 7
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number Case Type
Pressure (P1)
Side Identifier
MPX5010DP 867C Side with Part Marking
MPX5010GP 867B Side with Port Attached
MPX5010GS 867E Side with Port Attached
MPX5010GSX 867F Side with Port Attached
MPXV5010G6U 482 Stainless Steel Cap
MPXV5010GC6U/6T1 482A Side with Port Attached
MPXV5010GC7U 482C Side with Port Attached
MPXV5010GP 1369 Side with Port Attached
MPXV5010DP 1351 Side with Part Marking
MPVZ5010G6U
482
Stainless Steel Cap
MPVZ5010G7U
482B
Stainless Steel Cap
MPVZ5010GW6U
1735
Vertical Port Attached
MPVZ5010GW7U
1560
Vertical Port Attached
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1