Datasheet

MPXV5004G
Sensors
8 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
THROUGH-HOLE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 5.330.2200.210 5.59
D 0.660.0340.026 0.864
G 0.100 BSC 2.54 BSC
J 0.009 0.011 0.23 0.28
K 0.100 0.120 2.54 3.05
M 0 15 0 15
N 0.405 0.415 10.29 10.54
S 0.540 0.560 13.72 14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
PIN 1 IDENTIFIER
K
SEATING
PLANE
–T–
S
G
4
5
8
1
–A–
–B–
C
M
J
N
D 8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
DETAIL X
MILLIMETERSINCHES
0.100 BSC 2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
V
W
MIN
0.415
0.415
0.500
0.026
0.009
0.100
0˚
0.444
0.540
0.245
0.115
MAX
0.425
0.425
0.520
0.034
0.011
0.120
15˚
0.448
0.560
0.255
0.125
MIN
10.54
10.54
12.70
0.66
0.23
2.54
0˚
11.28
13.72
6.22
2.92
MAX
10.79
10.79
13.21
0.864
0.28
3.05
15˚
11.38
14.22
6.48
3.17
PIN 1
IDENTIFIER
K
SEATING
PLANE
-T-
W
DETAIL X
S
G
4
5
8
1
-A-
-B-
N
C
V
M
J
D 8 PL
S
B
M
0.25 (0.010) A
S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.