Datasheet

MPX2100
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS
NOTES:
1.
2.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.
D 4 PL
F
U
L
H
PORT #2
VACUUM
(P2)
POSITIVE
PRESSURE
(P1)
PIN 1
-A-
-Q-
S
K
G
-P-
S
Q
M
0.25 (0.010) T
S
S
M
0.13 (0.005) Q
S
T
12 34
SEATING
PLANE
B
N
R
C
J
-T-
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.158 3.89 4.04
R 0.230 0.250 5.84 6.35
S
U 0.910 BSC 23.11 BSC
0.220 0.240 5.59 6.10
CASE 344D-01
ISSUE B
UNIBODY PACKAGE