Datasheet

MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
Freescale Semiconductor 51
Package and pin listings
Figure 42. Mechanical dimensions and bottom surface nomenclature of the MPC8309 MAPBGA
Notes:
1. All dimensions are in millimeters.
2. Dimensions and tolerances per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.