Datasheet

MPC8250 Hardware Specifications, Rev. 2
Freescale Semiconductor 57
Package Description
5.2.1 TBGA Package Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
package.
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
Dim
Millimeters
Min Max
A 1.45 1.65
A1 0.60 0.70
A2 0.85 0.95
A3 0.25 —
b 0.65 0.85
D 37.50 BSC
D1 35.56 REF
e 1.27 BSC
E 37.50 BSC
E1 35.56 REF
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the